Preparation and Characterization of Ni Spines Grown on the Surface of Cubic Boron Nitride Grains by Electroplating Method

Cubic boron nitride (cBN) is widely applied in cutting and grinding tools. cBN grains plated by pure Ni and Ni/SiC composite were produced under the same conditions from an additive-free nickel Watts type bath. The processed electroplating products were characterized by the techniques of scanning electron microscopy (SEM), X-ray diffraction (XRD) and thermoanalysis (TG-DTA). Due to the presence of SiC particles, there are some additional nodules on the surface of Ni/SiC plated cBN compared with the pure Ni plated cBN. The unique morphology of Ni/SiC plated cBN should attain greater retention force in resin bond. Moreover, the coating weight of cBN grains could be controlled by regulating the plating time. cBN grains with 60% coating weight possess the optimum grinding performance due to their roughest and spiniest surface. In addition, Ni spines plated cBN grains show good thermal stability when temperature is lower than 464 °C. Therefore, the plated cBN grains are more stable and suitable for making resin bond abrasive tools below 225 °C. Finally, the formation mechanism of electroplating products is also discussed.